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A semiconductor diode chip itself cannot be functional and reliable device without proper packaging work. Packaging is a key process to ensure developing the most efficient and reliable environment for such semiconductor diode chips.

Coset materializes customer's design target with its extensive experience of handling various designs of semiconductor diode chips into industry standard or custom specification.

Coset packaging service is outsourcing partnering work with customers who need specialized manufacturing service to substitute own in-house facilities. A long field experience of carrying out telecom device manufacturing that require rigorous reliability standards guarantees quality controlled manufacturing services.

The ability of opto-electrical designing with dynamic creativeness is aligned to customers' target design idea; thus enabling prompt proof design prototypes and further modeling cost-effective volume production.

 
Collaboration Steps
Initial Designing: Electro-optical structuring
Spec Validation: Target spec review
Cost Validation: Initial / Volume cost configuration
Prototyping: Performance feedback
Reliability test: Selective qualification test
Volume production: Optimized solution for standard production
   
 
   
 
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