|A semiconductor diode chip itself cannot be
functional and reliable device without proper packaging work. Packaging
is a key process to ensure developing the most efficient and reliable environment
for such semiconductor diode chips.
Coset materializes customer's design target with its extensive experience
of handling various designs of semiconductor diode chips into industry
standard or custom specification.
Coset packaging service is outsourcing partnering work with customers
who need specialized manufacturing service to substitute own in-house
facilities. A long field experience of carrying out telecom device manufacturing
that require rigorous reliability standards guarantees quality controlled
The ability of opto-electrical designing with dynamic creativeness is
aligned to customers' target design idea; thus enabling prompt proof design
prototypes and further modeling cost-effective volume production.